Главная Кафедры Software engineering Новости кафедры Successful signing of the memorandum between Ruipan International Education Technology Co.Ltd and International Engineering and Technology University
24 June 2024                  225
Successful signing of the memorandum between Ruipan International Education Technology Co.Ltd and International Engineering and Technology University

         On June 24, 2024, an important visit took place where representatives from Ruipan International Education Technology Co., Ltd. of Beijing visited the International Engineering and Technology University. The visit was marked by a ceremony to sign a memorandum of understanding, which signifies a significant step towards developing cooperation between the two parties.

         During the meeting, key areas of collaboration were discussed, such as teacher training, organizing short-term study trips for students, and other promising projects. Both sides expressed interest in deepening cooperation and working together on innovative educational initiatives.

         "We are grateful to Ruipan International Education Technology Co., Ltd. for this visit and the opportunity to exchange experiences. The signed memorandum opens new horizons for our students and faculty," noted the university representatives.

          Ruipan International Education Technology Co., Ltd. also expressed gratitude for the warm reception and hopes for continued successful collaboration. The company invited the university rector and representatives to visit China for further discussions and to develop joint initiatives.